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1、手機(jī)開(kāi)發(fā)與設(shè)計(jì)流程詳解Topic 個(gè)人簡(jiǎn)介 BenQ 簡(jiǎn)介 產(chǎn)品開(kāi)發(fā)流程 手機(jī)開(kāi)發(fā)功能區(qū)塊 手機(jī)系統(tǒng)演進(jìn) 3G 介紹 手機(jī)功能發(fā)展趨勢(shì) 無(wú)線(xiàn)通信發(fā)展趨勢(shì)個(gè)人簡(jiǎn)介 個(gè)人簡(jiǎn)介個(gè)人簡(jiǎn)介u 2000年畢業(yè)於中山大學(xué)物理研究所年畢業(yè)於中山大學(xué)物理研究所u 2001.042006.03:明基儲(chǔ)存事業(yè)部研發(fā)處研發(fā)部明基儲(chǔ)存事業(yè)部研發(fā)處研發(fā)部Team Leader of Write Strategy Team/Firmware R&DSlim DVD+-R(RW)(12x)/DVD+-R(RW)(4x,8x,16x)/CDR(RW)(32x,40 x,48x)drive development團(tuán)隊(duì)發(fā)表世界第一

2、的4x,8x,DL,16x DVD燒錄機(jī)IEEE 論文發(fā)表發(fā)表4 篇專(zhuān)利 u 2006.032006.12:明基移動(dòng)通訊事業(yè)群專(zhuān)案管理部明基移動(dòng)通訊事業(yè)群專(zhuān)案管理部技術(shù)產(chǎn)品經(jīng)理-目前負(fù)責(zé) 3.5G HSDPA feature phone project明基明基BenQ 簡(jiǎn)介簡(jiǎn)介-享受快樂(lè)科技享受快樂(lè)科技數(shù)位時(shí)尚品牌數(shù)位時(shí)尚品牌3C數(shù)位整合數(shù)位整合國(guó)際級(jí)設(shè)計(jì)實(shí)力國(guó)際級(jí)設(shè)計(jì)實(shí)力1984年成立企業(yè)願(yuàn)景:傳達(dá)資訊生活的真善美1996年股票在臺(tái)灣上市2001年BenQ品牌誕生2005年?duì)I收:明基電通:新臺(tái)幣1,623億元明基集團(tuán):新臺(tái)幣3,979億元全球員工人數(shù)(2006/10)明基電通:13,000+

3、人 明基集團(tuán):68,000+人量做精品:量身訂做讓消費(fèi)者生活 充滿(mǎn)樂(lè)趣的網(wǎng)絡(luò)時(shí)尚產(chǎn)品獨(dú)特3C產(chǎn)品組合：將數(shù)位產(chǎn)品整合成符合未來(lái)消費(fèi)者生活型態(tài)的數(shù)位中樞 一 筆記型電腦、手機(jī)、數(shù)位電視享受快樂(lè)科技之企業(yè)享受快樂(lè)科技之企業(yè)化企業(yè)願(yuàn)景為品牌使命化企業(yè)願(yuàn)景為品牌使命1992BENQ Confidential(yyyy/mm/dd)2003,BENQ Corporation 2002 明基集團(tuán)企業(yè)願(yuàn)景1562632695234162846243517371,6501,6231,2082844271,1002,3473811,8753,6483,979單位單位:億元億元(新臺(tái)幣新臺(tái)幣)從製造代工到深耕技術(shù)

4、與設(shè)計(jì)之品牌從製造代工到深耕技術(shù)與設(shè)計(jì)之品牌單位單位:億元億元(新臺(tái)幣新臺(tái)幣)三大事業(yè)群三大事業(yè)群洞悉數(shù)位市場(chǎng)洞悉數(shù)位市場(chǎng) 掌握絕對(duì)優(yōu)勢(shì)掌握絕對(duì)優(yōu)勢(shì)獨(dú)特獨(dú)特5C策略策略 強(qiáng)化競(jìng)爭(zhēng)優(yōu)勢(shì)強(qiáng)化競(jìng)爭(zhēng)優(yōu)勢(shì)電子商品整合趨勢(shì)贏家電子商品整合趨勢(shì)贏家Computing 資訊產(chǎn)品資訊產(chǎn)品個(gè)人電腦,液晶顯示器,電腦週邊Consumer Electronics數(shù)位媒體產(chǎn)品數(shù)位媒體產(chǎn)品 數(shù)位投影機(jī),液晶電視,個(gè)人無(wú)線(xiàn)影音,數(shù)位相機(jī),車(chē)用顯示器Mobile Communications 移動(dòng)通信產(chǎn)品移動(dòng)通信產(chǎn)品行動(dòng)電話(huà)產(chǎn)品開(kāi)發(fā)流程產(chǎn)品開(kāi)發(fā)流程 Proposal 構(gòu)想階段 Plan 評(píng)估規(guī)劃階段 Design 設(shè)計(jì)階段

5、Execute 研發(fā)執(zhí)行階段 Mass production生產(chǎn)階段 Close 結(jié)束階段C SystemC1PlanningPhaseC2R&D DesignPhaseC3Lab PilotRun PhaseC4ENG PilotRun PhaseC5PD PilotRun PhaseMassProductionPhaseC6C0ProposalPhasePlanning-PM Manufacture -FactoryDesign-RD Product definitionFeasibility analysisID initiation Organize Project team memb

6、erProject schedule HW/SW design HW/SW design lock downHW/SW design approved Verification of Product maturity verificationProduction line set up Verification of production line maturity/stabilityProduct design finalized Mass production DVT PhaseMVT PhaseQVT PhaseDVT:Design Verification TestingMVT:Man

7、ufacture Verification TestingQVT:Quality Verification TestingLPR:Laboratory Pilot RunEPR:Engineering Pilot RunPPR:Production Pilot RunMP:Mass ProductionMobile development function IntroductionMobile development function 外觀(guān)設(shè)計(jì)(ID)Industry Design 機(jī)構(gòu)設(shè)計(jì)(MD)Material Design硬體設(shè)計(jì)(HW)Hard Ware BB(Base Band 基頻

8、)RF(Radio Frequency 射頻)Antenna(天線(xiàn))軟體設(shè)計(jì)(SW)Soft Ware MMI(Man Machine Interface 人機(jī)介面)Protocol DriverFunctional Architecture of Mobile TodayFeature List-HW Camera Sony 2.0 Mega Pixel CMOS Auto Focus camera Strobe LED flash lightDisplay AUO 2.0”AMOLED 176x220 Pixels,262K colorsMemory NOR Flash:128Mbit,P

9、SRAM:64Mbit,NAND:256Mbit SDRAM:128MbitExternal Memory T-FlashI/O DC Jack,10 pin I/OConnectivity USB1.1,BluetoothIDVol.Up/Vol.Down2 Segment Shutter KeyMode Switch Key10 Pin I/ODC JackMicrophoneReceiverT-Flash CardMD:Appearance treatment descriptionA鋁板陽(yáng)極+噴砂B塑膠射出+噴漆C塑膠射出+噴漆D塑膠射出+噴漆E平板背印FP+R噴塗雷雕GH雙料射出+噴

10、漆IRUBBERJ電鍍K電鍍L玻璃背印M塑膠射出+背印N 銘版髮絲處理PQ噴漆Exploded drawing1235810796111241513141716Front case assy.Keypad assy.Main lensJoystick capOLED moduleReceiverKeypad FPCMain PCB assy.DSC moduleDSC FPCDSC holderSpeakerVibratorRear case assy.Antenna coverBattery cover.Battery pack.Placement description-IShieldin

11、g case 1-BBShielding case 2-BBT-flash connector(push-push type)Pogo pin(for ESD)Back-up battery(Capacitor)30pin BTB Conn.(for DSC module)Joystick(Mitsumi)SMT-type MICPlacement description-III/O connectorBattery connectorMode switchBT antenna switchDC jackAntenna connectorAntenna switchSide-key(Vol-k

12、ey)RF shielding case10 pin Conn.(Spk.and flash)LCM connectorBB shielding caseSIM connectorKey FPC connectorHW Block Diagram-2GRFDBBABBMMPAudio CODECSIMChargingBTLoud SpeakerReceiver/MIC.HeadsetKeypadNOR Flash/PSRAMLCDMDSCNANDUSBSD CardPlacement(Top Side)Antenna RF Area10 Pin I/OBattery ConnectorIOTA

13、SIM ConnectorG23 Combo Memory LCDM ConnectorKeypad ConnectorBT AreaDC JackPlacement(Bottom Side)Audio CODECMMPMIC.T Flash ConnectorOLED Limit AreaLevel ShifterCamera ConnectorReceiverCharging ICPower ICAntennaSW Feature ReviewBandTri-band GSM/GPRS 900/1800/1900,GPRS Class 10Tri-band GSM/GPRS 850/180

14、0/1900,GPRS Class 10Speech CodecFR/EFR/HF/AMREmbedded DSC2.0 Mega Pixel CMOS sensor with Auto Focus+LED flash lightMemoryRSS 3 combo:NOR flash:128Mb,Pseudo SRAM:64Mb,Super-AND:256Mb,SDRAM:SH-Mobile J2 embedded 128MbConnectivityUSB 1.1(MSC,CDC,Pict-Bridge),Bluetooth(A2DP,HS/HF,BIP,OPP,DUN)JavaMIDP 2.

15、0,CLDC1.1,JTWIMP3,MelodyMP3/AAC(3D,EQ)/AAC+,SW-MIDIVoice recordingAMRVideo recording/playingMP4,3GP,H.263OMA DRM 1.0SW Architecture-2GToolMMIXPI(Extend Programming Interface)Layer-1/DriverServiceDisplayInputMenuPPFAPCameraMP3PIMToolProtocolCCWAPSTKJavaMessageSMSEMSMMSEmailPS(Protocol Stack)OS手機(jī)系統(tǒng)演進(jìn)3

16、G Evolution OverviewAnalogcdmaOneUSGSM EuropeTDMA USPDC JPGPRSEDGEWCDMA(UMTS,ULTRA FDD)HSDPAcdma 2000cdma2000(1xEVDO)cdma2000(1xEVDV)TD-SCDMAChina1G2G2.5G3G3.5G3G introductionRF chipsetBB chipsetPower Mgmt IC3G Mobile HWSirius BREW-3GApplicationsDevice driverServicesBREW OEMBREWExtensionsBREW3G手機(jī)單晶片

17、趨勢(shì)多模式應(yīng)用WEDGE晶片(WCDMA+EDGE)支援WCDMA、EDGE、GPRS、GSM和HSDPA標(biāo)準(zhǔn)可以在2G和3G網(wǎng)路間切換（roaming）以CMOS製程應(yīng)用,達(dá)到低成本減少零組件數(shù)、縮小尺寸、降低功耗，及提高效能等3G-3.5GHSDPA網(wǎng)路陸續(xù)開(kāi)通網(wǎng)路陸續(xù)開(kāi)通 3G升級(jí)到3.5G，不需再進(jìn)行基地臺(tái)建設(shè)，只需軟體升級(jí)3.5G網(wǎng)路的下載傳輸速率已達(dá)3.6Mbps(比3G快9倍,甚至高於一般家用的2M ADSL)2010年預(yù)計(jì)行動(dòng)數(shù)據(jù)服務(wù)將會(huì)超越行動(dòng)語(yǔ)音服務(wù)，為手機(jī)系統(tǒng)業(yè)者最重要的收入來(lái)源 預(yù)計(jì)全球3.5G用戶(hù)數(shù)將從250萬(wàn)個(gè)(2006年)，成長(zhǎng)到3億個(gè)(2011年)臺(tái)灣業(yè)者臺(tái)灣業(yè)

18、者 中華電信:採(cǎi)諾基亞的系統(tǒng),只開(kāi)通支援1.8Mbps的HSDPA網(wǎng)路服務(wù) 遠(yuǎn)傳電信:採(cǎi)易利信的系統(tǒng),推廣傳輸速率高達(dá)3.6Mbps的HSDPA網(wǎng)路 支援3.6Mbps的手機(jī)尚未到位，只能以3.5G數(shù)據(jù)網(wǎng)卡先行困難困難 2007 年會(huì)大幅改善年會(huì)大幅改善 網(wǎng)路涵蓋率不足 3.5G手機(jī)選擇少,價(jià)格高手機(jī)功能發(fā)展趨勢(shì)手機(jī)功能發(fā)展趨勢(shì)-高整合化高整合化重外觀(guān)設(shè)計(jì)重外觀(guān)設(shè)計(jì)個(gè)人化個(gè)人化多媒體多媒體多用途多用途手機(jī)功能發(fā)展趨勢(shì)-整合通訊(Voice)，資訊(Data)，傳播(Video)和無(wú)線(xiàn)(Wireless)現(xiàn)有功能 Mobile/Music/Video/Camera/Recorder/Game S

19、torage Memory/FM radio/Application/Brower/High data rate/Connectivity:E-mail,BT,USB,IrDA/Light/Indicator/Voice recognition GPS/A-GPS -定位導(dǎo)航/LBS位置資訊服務(wù)（Location Based Services）TV-Out 2D Bar code/QR Code新功能發(fā)展 數(shù)位電視DVB-H/廣播 Finger Printer 電子錢(qián)包:NFC近距離無(wú)線(xiàn)傳輸（Near Field Communication,NFC）Projector 手機(jī)投影無(wú)線(xiàn)通信發(fā)展趨勢(shì)

20、無(wú)線(xiàn)通信發(fā)展趨勢(shì)Functional Architecture of Mobile TomorrowFMC(Fixed-Mobile Convergence)固網(wǎng)行動(dòng)聚合 固網(wǎng)和行動(dòng)網(wǎng)融合:FMC（Fixed-Mobile Convergence)-無(wú)縫隙不間斷的通訊品質(zhì) 由各種裝置、服務(wù)、網(wǎng)路，以及技術(shù)所融合而成 Whats IMS?Whats IMS?UMA-Unlicensed Mobile Access 提出一套解決方案，讓使用授權(quán)頻段的GSM和GPRS和使用無(wú)需授權(quán)頻段的Bluetooth和802.11彼此間能夠互相漫遊 可用單一手機(jī)享受雙網(wǎng)合一的優(yōu)勢(shì)，甚至兼具節(jié)省話(huà)費(fèi)的好處。UMA（Unlicensed Mobile Access）對(duì)用戶(hù)來(lái)說(shuō)，採(cǎi)用UMA的技術(shù)後，在手機(jī)網(wǎng)路和WiFi或Bluetooth網(wǎng)路之間的切換是由系統(tǒng)來(lái)完成的，用戶(hù)一點(diǎn)感覺(jué)都沒(méi)有