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1、Titelmasterformat durch Klicken bearbeiten,,Textmasterformate durch Klicken bearbeiten,,Zweite Ebene,,Dritte Ebene,,Vierte Ebene,,Fünfte Ebene,,,*,Titelmasterformat durch Klicken bearbeiten,,Textmasterformate durch Klicken bearbeiten,,Zweite Ebene,,Dritte Ebene,,Vierte Ebene,,Fünfte Ebene,,,*,EP,,He

2、ading Level One,,First line,,Second line,,Third line,,Fourth line,,Fifth line,,,,*,BenQ Confidential (yyyy/mm/dd),?,2005, BenQ Corporation,First line,,Second line,,Third line,,Fourth line,,Fifth line,,,,*,BenQ Confidential (03/01/2006),?,2006, BenQ Corporation,,STRICTLY CONFIDENTIAL,Click to edit Ma

3、ster title style,,First line,,Second line,,Third line,,Fourth line,,Fifth line,,,,*,BenQ Confidential (03/01/2006),?,2006, BenQ Corporation,,STRICTLY CONFIDENTIAL,Click to edit Master title style,,按一下以編輯母片標(biāo)題樣式,,按一下以編輯母片,,第二層,,第三層,,第四層,,第五層,,BenQ,Confidential (2005/07/01),?,2005, BenQ Corporation,按一下

4、以編輯母片標(biāo)題樣式,,按一下以編輯母片,,第二層,,第三層,,第四層,,第五層,,BenQ,Confidential (2005/07/01),?,2005, BenQ Corporation,First line,,Second line,,Third line,,Fourth line,,Fifth line,,,,*,BenQ Confidential (03/01/2006),?,2006, BenQ Corporation,,Click to edit Master title style,,First line,,Second line,,Third line,,Fourth li

5、ne,,Fifth line,,,,*,BenQ Confidential (03/01/2006),?,2006, BenQ Corporation,,Click to edit Master title style,,Heading Level One,,First line,,Second line,,Third line,,Fourth line,,Fifth line,,,,*,Titelmasterformat durch Klicken bearbeiten,,Textmasterformate durch Klicken bearbeiten,,Zweite Ebene,,Dr

6、itte Ebene,,Vierte Ebene,,Fünfte Ebene,,,,按一下以編輯母片標(biāo)題樣式,,按一下以編輯母片,,第二層,,第三層,,第四層,,第五層,,,按一下以編輯母片標(biāo)題樣式,,按一下以編輯母片,,第二層,,第三層,,第四層,,第五層,,演示文檔,路漫漫其悠遠(yuǎn),少壯不努力，老大徒悲傷,單擊此處編輯母版標(biāo)題樣式,,單擊此處編輯母版文本樣式,,第二級(jí),,第三級(jí),,第四級(jí),,第五級(jí),,*,,*,詳解手機(jī)開發(fā)與設(shè)計(jì)流程,Topic,個(gè)人簡介,,明基,BenQ,簡介,,產(chǎn)品開發(fā)流程,,手機(jī)開發(fā)功能區(qū)塊,,手機(jī)系統(tǒng)演進(jìn),,3G,介紹,,手機(jī)功能發(fā)展趨勢,,無線通信發(fā)展趨勢,,,個(gè)人

7、簡介,,個(gè)人簡介,2000,年畢業(yè)於中山大學(xué)物理研究所,,2001.04~2006.03:,明基儲(chǔ)存事業(yè)部研發(fā)處研發(fā)部,,Team Leader of Write Strategy Team / Firmware R&D,,Slim DVD+-R(RW)(12x)/DVD+-R(RW)(4x,8x,16x)/CDR(RW)(32x,40x,48x) drive development,,團(tuán)隊(duì)發(fā)表世界第一的,4x, 8x, DL, 16x DVD,燒錄機(jī),,IEEE,論文發(fā)表,,發(fā)表,4,篇專利,,2006.03~2006.12:,明基移動(dòng)通訊事業(yè)群專案管理部,,技術(shù)產(chǎn)品經(jīng)理,-,目前負(fù)責(zé),3

8、.5G HSDPA feature phone project,明基,BenQ,簡介,-,享受快樂科技,,數(shù)位時(shí)尚品牌,3C,數(shù)位整合國際級(jí)設(shè)計(jì)實(shí)力,1984,年成立,,企業(yè)願(yuàn)景,:,傳達(dá)資訊生活的真善美,,1996,年股票在臺(tái)灣上市,,2001,年,BenQ,品牌誕生,,2005,年?duì)I收,:,,明基電通,:,新臺(tái)幣,1,623,億元,,明基集團(tuán),:,新臺(tái)幣,3,979,億元,,全球員工人數(shù),(2006/10),,明基電通,: 13,000+,人,,明基集團(tuán),: 68,000+,人,,「量做精品」,:,量身訂做讓消費(fèi)者生活,,充滿樂趣的網(wǎng)絡(luò)時(shí)尚產(chǎn)品,,獨(dú)特,3C,產(chǎn)品組合：將數(shù)位產(chǎn)品整合成符

9、合未來消費(fèi)者生活型態(tài)的數(shù)位中樞 一,,筆記型電腦、手機(jī)、數(shù)位電視,享受快樂科技之企業(yè),化企業(yè)願(yuàn)景為品牌使命,,1992,2002,,明基集團(tuán)企業(yè)願(yuàn)景,156,263,269,52,68,3,11,26,416,284,624,351,737,1,047,1,650,1,623,1,208,284,777,427,1,100,2,347,381,1,875,3,648,3,979,BenQ,Group,BenQ,,Corp.,單位,:,億元,(,新臺(tái)幣,),,,,,,,Phase 1,,,1984-1991,,OEM,,,,,,,強(qiáng)大的,,生產(chǎn)製造能力,,,,從製造代工到深耕技術(shù)與設(shè)計(jì)之品牌,P

10、hase 2,,,1991-2001,,From OEM to ODM,,,,,,,多元化的技術(shù)投資,,“水平整合,+,專業(yè)分工”,,,Phase 3,,,2001-2006,,From ODM to Branded Business,,,,,,數(shù)位時(shí)尚品牌,,3C,數(shù)位整合,,國際級(jí)設(shè)計(jì)實(shí)力,,單位,:,億元,(,新臺(tái)幣,),三大事業(yè)群,明基電通,移動(dòng)通信,,事業(yè)群,,(MCG),數(shù)位媒體,,事業(yè)群,,(DMG),整合製造服務(wù),,事業(yè)群,(IMS),洞悉數(shù)位市場 掌握絕對優(yōu)勢,獨(dú)特,5C,策略 強(qiáng)化競爭優(yōu)勢,電子商品整合趨勢贏家,Computing,,資訊產(chǎn)品,,個(gè)人電腦,,,液晶顯示器

11、,,,,電腦週邊,,Consumer Electronics,,數(shù)位媒體產(chǎn)品,,數(shù)位投影機(jī),,,液晶電視,,,,個(gè)人無線影音,,,,,數(shù)位相機(jī),,,車用顯示器,Mobile Communications,,移動(dòng)通信產(chǎn)品,,行動(dòng)電話,產(chǎn)品開發(fā)流程,產(chǎn)品開發(fā)流程,Proposal,構(gòu)想階段,,Plan,評(píng)估規(guī)劃階段,,Design,設(shè)計(jì)階段,,Execute,研發(fā)執(zhí)行階段,,Mass production,生產(chǎn)階段,,Close,結(jié)束階段,,,,,,C System,,C1,Planning,,Phase,,,C2,R&D Design,,Phase,,,C3,Lab Pilot,,Run Pha

12、se,,,C4,ENG Pilot,,Run Phase,,,C5,PD Pilot,,Run Phase,,Mass,,Production,,Phase,,,C6,,C0,Proposal,,Phase,,,Planning-PM,,,Manufacture,,-Factory,Design-RD,,,Product definition,,Feasibility analysis,,ID initiation,Organize Project team member,,Project schedule,HW/SW design,HW/SW design lock down,,HW/SW

13、 design approved,Verification of Product maturity verification,,Production line set up,Verification of production line maturity /stability,,Product design finalized,Mass production,DVT Phase,MVT Phase,QVT Phase,,,,DVT : Design Verification Testing,,MVT: Manufacture Verification Testing,,QVT : Quali

14、ty Verification Testing,,,,,,,,LPR: Laboratory Pilot Run,,EPR: Engineering Pilot Run,,PPR: Production Pilot Run,,MP: Mass Production,Mobile development function Introduction,Mobile development function,外觀設(shè)計(jì),(ID),Industry Design,,機(jī)構(gòu)設(shè)計(jì),(MD),Material Design,,硬體設(shè)計(jì),(HW) Hard Ware,,BB (Base Band,基頻,),,RF

15、(Radio Frequency,射頻,),,Antenna (,天線,),,軟體設(shè)計(jì),(SW) Soft Ware,,MMI (Man Machine Interface,人機(jī)介面,),,Protocol,,Driver,Functional Architecture of Mobile Today,Feature List-HW,[Camera ],,Sony 2.0 Mega Pixel CMOS Auto Focus camera,,[Strobe],,LED flash light,,[Display],,AUO 2.0” AMOLED 176x220 Pixels , 262K c

16、olors,,[Memory],,NOR Flash: 128Mbit, PSRAM: 64Mbit, NAND: 256Mbit,,SDRAM : 128Mbit,,[External Memory],,T-Flash,,[I/O],,DC Jack , 10 pin I/O,,[Connectivity],,USB1.1 , Bluetooth,ID,Vol. Up / Vol. Down,2 Segment Shutter Key,,,Mode Switch Key,,10 Pin I/O,,DC Jack,,,Microphone,Receiver,,T-Flash Card,,MD

17、: Appearance treatment description,A,鋁板陽極,+,噴砂,B,塑膠射出,+,噴漆,C,塑膠射出,+,噴漆,D,塑膠射出,+,噴漆,E,平板背印,F,P+R,噴塗雷雕,G,,H,雙料射出,+,噴漆,I,RUBBER,J,電鍍,K,電鍍,L,玻璃背印,M,塑膠射出,+,背印,N,銘版髮絲處理,P,,Q,噴漆,Exploded drawing,1,2,3,5,8,10,7,9,6,11,12,4,15,13,14,17,16,Front case assy.,,Keypad assy.,,Main lens,,Joystick cap,,OLED module,,

18、Receiver,,Keypad FPC,,Main PCB assy.,,DSC module,,DSC FPC,,DSC holder,,Speaker,,Vibrator,,Rear case assy.,,Antenna cover,,Battery cover.,,Battery pack.,Placement description - I,Shielding case 1 -BB,Shielding case 2 -BB,T-flash connector,,(push-push type),Pogo pin (for ESD),Back-up battery,,(Capacit

19、or),30pin BTB Conn.,,(for DSC module),Joystick,,(Mitsumi),SMT-type MIC,Placement description - II,I/O connector,Battery connector,Mode switch,BT antenna switch,DC jack,Antenna connector,Antenna switch,Side-key (Vol-key),RF shielding case,10 pin Conn.,,(Spk. and flash),LCM connector,BB shielding case

20、,SIM connector,Key FPC connector,HW Block Diagram-2G,,Placement (Top Side),,Antenna,RF Area,,10 Pin I/O,Battery Connector,,,,IOTA,SIM Connector,G2,3 Combo,,Memory,,,,,LCDM Connector,,Keypad Connector,,BT Area,,DC Jack,Placement (Bottom Side),Audio CODEC,,,MMP,MIC.,,,T Flash Connector,,OLED Limit Are

21、a,,Level Shifter,Camera Connector,,,Receiver,,Charging IC,Power IC,,Antenna,SW Feature Review,Band,Tri-band GSM/GPRS 900/1800/1900, GPRS Class 10,,Tri-band GSM/GPRS 850/1800/1900, GPRS Class 10,Speech Codec,FR/EFR/HF/AMR,Embedded DSC,2.0 Mega Pixel CMOS sensor with Auto Focus + LED flash light,Memor

22、y,RSS 3 combo: NOR flash: 128Mb, Pseudo SRAM: 64Mb, Super-AND: 256Mb, SDRAM: SH-Mobile J2 embedded 128Mb,Connectivity,USB 1.1 (MSC, CDC, Pict-Bridge), Bluetooth (A2DP, HS/HF, BIP, OPP, DUN),Java,MIDP 2.0, CLDC1.1, JTWI,MP3, Melody,MP3/AAC(3D, EQ)/AAC+, SW-MIDI,Voice recording,,AMR,Video recording/pl

23、aying,,MP4, 3GP, H.263,DRM,OMA DRM 1.0,SW,Architecture-2G,,Tool,MMI,XPI ( Extend Programming Interface),Layer-1 / Driver,Service,,Display,,Input,,Menu,,PPF,,…,AP,,Camera,,MP3,,PIM,,Tool,,…,Protocol,,CC,,WAP,,STK,,Java,,…,Message,,SMS,,EMS,,MMS,,Email,,…,PS ( Protocol Stack),OS,,,,,,手機(jī)系統(tǒng)演進(jìn),3G Evoluti

24、on Overview,Analog,cdmaOne,,[US],GSM [Europe],TDMA [US],PDC [JP],GPRS,EDGE,WCDMA,,(UMTS, ULTRA FDD),HSDPA,cdma 2000,cdma2000,,(1xEVDO),cdma2000,,(1xEVDV),TD-SCDMA,,[China],1G,2G,2.5G,3G,3.5G,3G introduction,,,RF chipset,BB chipset,,Power Mgmt IC,3G Mobile HW,Sirius BREW-3G,,,,,,Applications,Device d

25、river,Services,,BREW OEM,,BREW,,Extensions,,,BREW,,,,3G,手機(jī)單晶片趨勢,多模式應(yīng)用,WEDGE,晶片,( WCDMA+EDGE),,支援,WCDMA,、,EDGE,、,GPRS,、,GSM,和,HSDPA,標(biāo)準(zhǔn),,可以在,2G,和,3G,網(wǎng)路間切換（,roaming,）,,以,CMOS,製程應(yīng)用,,,達(dá)到低成本減少零組件數(shù)、縮小尺寸、降低功耗，及提高效能等,3G -->3.5G,HSDPA,網(wǎng)路陸續(xù)開通,,3G,升級(jí)到,3.5G,，不需再進(jìn)行基地臺(tái)建設(shè)，只需軟體升級(jí),,3.5G,網(wǎng)路的下載傳輸速率已達(dá),3.6Mbps,(,比,3G,快,9

26、,倍,,,甚至高於一般家用的,2M,ADSL),,2010,年預(yù)計(jì),行動(dòng)數(shù)據(jù)服務(wù),將會(huì)超越,行動(dòng)語音服務(wù),，為手機(jī)系統(tǒng)業(yè)者最重要的收入來源,,預(yù)計(jì)全球,3.5G,用戶數(shù)將從,250,萬個(gè),(2006,年,),，成長到,3,億,個(gè),(2011,年,),,,臺(tái)灣業(yè)者,,中華電信,:,採諾基亞的系統(tǒng),,,只開通支援,1.8Mbps,的,HSDPA,網(wǎng)路服務(wù),,遠(yuǎn)傳電信,:,採易利信的系統(tǒng),,,推廣傳輸速率高達(dá),3.6Mbps,的,HSDPA,網(wǎng)路,,支援,3.6Mbps,的手機(jī)尚未到位，只能以,3.5G,數(shù)據(jù)網(wǎng)卡先行,,困難,–,2007,年會(huì)大幅改善,,網(wǎng)路涵蓋率不足,,3.5G,手機(jī)選擇少,,,

27、價(jià)格高,手機(jī)功能發(fā)展趨勢,-,高整合化,重外觀設(shè)計(jì),,個(gè)人化,,多媒體,,多用途,手機(jī)功能發(fā)展趨勢,-,整合通訊,(Voice),，資訊,(Data),，傳播,(Video),和無線,(Wireless),,現(xiàn)有功能,,Mobile/Music/Video/Camera/Recorder/Game,,Storage Memory/FM radio/Application/Brower/High data rate/Connectivity : E-mail, BT, USB, IrDA/Light/Indicator/ Voice recognition,,GPS/A-GPS ->,定位導(dǎo)航

28、,/LBS,位置資訊服務(wù)（,Location Based Services,）,,TV-Out,,2D Bar code/QR Code,,新功能發(fā)展,,數(shù)位電視,DVB-H /,廣播,,Finger Printer,,電子錢包,:NFC,近距離無線傳輸（,Near Field Communication, NFC,）,,Projector,,手機(jī)投影,無線通信發(fā)展趨勢,無線通信發(fā)展趨勢,Functional Architecture of Mobile Tomorrow,FMC ( Fixed-Mobile Convergence),固網(wǎng)行動(dòng)聚合,固網(wǎng)和行動(dòng)網(wǎng)融合,: FMC,（,Fixed

29、-Mobile Convergence)-,無縫隙不間斷的通訊品質(zhì),,由各種裝置、服務(wù)、網(wǎng)路，以及技術(shù)所融合而成,What’s IMS?,What’s IMS?,UMA-Unlicensed Mobile Access,提出一套解決方案，讓使用授權(quán)頻段的,GSM,和,GPRS,和使用無需授權(quán)頻段的,Bluetooth,和,802.11,彼此間能夠互相漫遊,,可用單一手機(jī)享受雙網(wǎng)合一的優(yōu)勢，甚至兼具節(jié)省話費(fèi)的好處。,UMA,（,Unlicensed Mobile Access,）,,對用戶來說，採用,UMA,的技術(shù)後，在手機(jī)網(wǎng)路和,WiFi,或,Bluetooth,網(wǎng)路之間的切換是由系統(tǒng)來完成的，用戶一點(diǎn)感覺都沒有,Question?,