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1、Click to edit Master title style,,Click to edit Master text styles,,Second level,,Third level,,Fourth level,,Fifth level,,*,,*,Click to edit Master title style,,Click to edit Master text styles,,Second level,,Third level,,Fourth level,,Fifth level,,,,*,,線路板專業(yè)名詞解釋,Title,,,印制電路：,printed circuit,,印制線路：

2、,printed wiring,,印制板：,printed board,,印制板電路：,printed circuit board (pcb),,印制線路板：,printed wiring board(pwb),,印制元件：,printed component,,印制接點(diǎn)：,printed contact,,印制板裝配：,printed board assembly,,,板：,board,第一篇： 常用術(shù)語,,,,10.,單面印制板：,single-sided printed board(ssb),11.,雙面印制板：,double-sided printed board(dsb),

3、12.,多層印制線路板：,mulitlayer printed wiring board13.,剛性印制板：,rigid printed board14.,剛性單面印制板：,rigid single-sided printed board 15.,剛性雙面印制板：,rigid double-sided printed board17.,剛性多層印制板：,rigid multilayer printed board,,,,,,18,. MI: Manufacture Instruction (制作指示),19,. ECN: Engineering Change Notice,(工程更

4、改通知),20,. MOR：Marketing Order Release,OC : Order Confirmation (定單),21,. IPC --- The Institute for Interconnecting,and packaging Electronic Circuits,,(美國電子電路互連與封裝協(xié)會),,,,22.,UL,:Underwrites’ Laboratories(,美國保險(xiǎn)商實(shí) 驗(yàn)所),23.,,ISO,--International Standards Organization,國際標(biāo)準(zhǔn)化組織,24.,,On hold and Rele

5、ase,:,暫停和釋放,25.,,SPEC,: specification,客戶規(guī)格書,26.,,WIP,: Work in process,正在生產(chǎn)線上生產(chǎn)的 產(chǎn)品,27.,,Gerber file,:,軟件包,28.,,Master A/W,:,客戶原裝菲林,29.,,Net list,:,客戶提供的表明開短路的文件,30.,HMLV,: High Mixed Low Volume,,多批少量,,,31.,TCN： Temporary Change notice,臨時(shí)更改通知,32,. ENIG : Electroless Nickel /Immersion Gold,(IPC

6、-4552),33,. OSP : Organic Surface protection,,,34,.,I,T,:,I,mmersion Tin,,35.,IS: Immersion Silver,36.,HAL: Hot air leveling,,,第二篇： 有關(guān)材料,1.,Copper-clad Laminate,:,覆銅箔基材,2.,Prepreg,:,聚酯膠片,3.,FR-4(Flame Retardant -4),:,一種用玻璃布和環(huán)氧樹脂制造有阻燃性能的材料,4.,Solder mask,:,阻焊劑,5.,Peelable solder mask,:,藍(lán)

7、膠,7.,Dry film,:,干膜,6.,Carbon Ink,:,碳油,8.,RCC,: Resin Coated Copper (,不含玻璃布),,,9.基材：,base material,10.,層壓板：,laminate,11.,覆金屬箔基材：,metal-clad bade material,12,、,,覆銅箔層壓板：,copper-clad laminate (ccl),13,、,,單面覆銅箔層壓板：,single-sided copper-clad laminate,14,、,,雙面覆銅箔層壓板：,double-sided copper-clad laminate,15,、,,

8、復(fù)合層壓板：,composite laminate,16,、,,薄層壓板：,thin laminate,17,、,,金屬芯覆銅箔層壓板：,metal core copper-clad laminate,18,、,,金屬基覆銅層壓板：,metal base copper-clad laminate,,,第三篇： 有關(guān)工序,,,PTH,1.,PTH:,(Plated through hole),電鍍孔,A.,Via hole,:,通路孔。,作用：,,B.,IC hole,:,插件孔。,作用：,,僅作為導(dǎo)通用（不作插件或焊接），如測試點(diǎn)和一般導(dǎo)通孔。,用于插件或焊接，也可導(dǎo)通

9、內(nèi)外層。,,,,,,2.,NPTH：,作用：,一般是作為裝配零件的定位孔或工具孔。,NPTH,(,Non-plated through hole),非電鍍孔,,,,,,,3.,SMT/SMD,,Surface Mounting Technology:,表面貼覆技術(shù),,SMT Pad:,SMT,,指在線路板表面帖覆焊接元件的,Pad，,包括,QFP (Quad flat pad)，2-Roll,等。,,這些也是,SMT pad,,,4.,BGA/CSP:,BGA---Ball Grid Array,CSP--- Chip Scale package,,要求：,一般,BGA,區(qū)域,VIA,孔要求塞

10、孔,,,,,說明：,它們都是一種封裝技術(shù)。在,PCB,上都表現(xiàn)為一 VIA孔聯(lián)了一個(gè)焊接PAD。,BGA/CSP,BGA Pad,Line,Via Hole,,,5.,Fiducial mark :,作用：,,裝配時(shí)作為對位的標(biāo)記,說明：,它是非焊接用的焊盤，通常為圓形或方形，有金屬窗和綠油窗。,Fiducial mark,,,,,6.,Dummy pattern(thief pattern)：,作用：,,使整塊板的線路分布更均勻，從而提高圖電質(zhì)量和減少板的曲度和扭度,。,要求：,,通常以不影響線路為標(biāo)準(zhǔn)，,一般為又有三種：,圓形/ 方形----命名為“,Dummy”,網(wǎng)狀----命名為“網(wǎng)

11、狀,Dummy”,銅皮------命名為“銅皮”,,Dummy,,,,7. 無孔測試,Pad：,,Text Pad/Breaking Tab,此類,Pad,僅供裝配完后作為測試點(diǎn)，不裝配零件。,不包括,SMT PAD, BGA PAD, Fiducial mark pad.,8.,Breaking Tab：,,印制板上無電氣性能，在制作過程中用于加工具孔、定位孔或,Dummy,等的部分。與線路板主體部分相連處有折斷孔或,V-Cut。,Breaking Tab,V-Cut,,,9.,Thermal,：,,作用：,它使在焊接時(shí)因截面過分散熱而產(chǎn)生虛焊的可能性減少。,(,heat shield）,熱

12、隔離盤 （,大面積導(dǎo)電圖形上，元件周 圍被蝕刻掉的部分）,Thermal/Clearance,10.,Clearance：,無銅,空間（通常指銅皮上為孔開的無銅區(qū)域）,,,,,,,,,,,11.,S/M Bridge：,作用：,防止焊接時(shí),Pad,間被焊錫短路。,阻焊橋（裝配,Pad,間的阻焊條）,S/M bridge,S/M Bridge,Solder mask in these areas,,,,,,,,,,,,,,,,,,,S/M bridge,,,,,12.,Gold finger：,金手指,說明：,電鍍金耐磨。,一般金指的,S/M OPENING,均為整體開窗。,13.,Key

13、slot：,鍵槽,作用：,使印制板（金手指）只能插入與之配合的連接器 中，防止插入其他連接器中的槽口。,要求：,一般公差要求較緊。,14.,Beveling：,金指斜邊,Gold finger/Key slot/Beveling,,,,,,,,,,,,15.,VIP：,要求：,一般為,S,面塞孔，,C,面作為,SMT PAD。,16.,VOP：,(,Via In Pad) Via,孔位于,SMT Pad,上。,說明：,(,Via On Pad) Via,孔先被樹脂塞滿，其表面（一面或兩面）經(jīng)過打磨、沉銅、板電鍍等工序后，要求作為裝配,Pad。,VIP/VOP,S,面塞孔,,,SMT Pa

14、d,Via hole,,,,,,,,,,,,,,,樹脂塞孔,SMT Pad,,,,,,,Blind/Buried hole,17.,Blind/Buried hole：,盲,/,埋孔,盲孔：從一個(gè)表面開始，在內(nèi)層結(jié)束，未貫穿整板的孔。,埋孔：不經(jīng)過兩外表面，只在某些內(nèi)層中貫穿的孔。,,,,,,,,,,,,,,,,,,,,,,,,盲孔,埋孔,,,19,. LDI,,High Density Interconnection :,高密度互聯(lián),----特點(diǎn)：直接用激光在干膜上曝光，不必用菲林 ，能保證完成線寬更細(xì) 。,18,. HDI,,,Laser Direct Image ---,鐳射直接曝光,

15、----特點(diǎn)：一般線寬/線間小于3,mil/3mil,,導(dǎo)通孔小于8,mil, microvia,一般,要求用激光鉆孔。,,,20.,Heat sink:,Side face,Bottom Side,Top Side,PCB,Pallet,大銅塊,Prepreg,PCB+Prepreg+Pallet,,,Aspect ratio,21.,Aspect Ratio：,縱橫比（板厚孔徑比）---影響電鍍和噴錫,說明：,一般采用板厚最大值與最小孔徑之比。,d,H,,,,,,,,,,,,,,,,,,,,,,,,,D,,Aspect Ratio = d / H,,,22.,AGP:,,,,顯卡,主顯示芯

16、片,AGP,,,23.,Mother board:,,,,內(nèi)存插孔,PCI,插槽,CPU,插座,,AGP,插槽,主(機(jī))板,Motherboard,,,24,.,Memory bank:,Memory bank,內(nèi)存條,,內(nèi)存芯片組,,,第四篇： 檢查與測試,,,,,,,,,,,歐盟,RoHS & WEEE,指令對無鉛,PCB,要求,,無鉛,PCB,必須滿足歐盟,RoHS（Restriction of the use of certain Hazardous Substances in electrical and electronic equipment）2002/9

17、5/EC,指令 和《電子信息產(chǎn)品生產(chǎn)污染防治管理辦法》的規(guī)定，從2006年7月開始禁用六種物質(zhì),（鉛、鎘、六價(jià)鉻、水銀、,PBB（,多溴化聯(lián)苯）、,PBDE（,多溴聯(lián)苯醚）。其中,PCB,板主要檢測項(xiàng)目包括：,PCB,基材、阻焊、絲印、銅皮等。,,,,,If this specification conflicts with any other documents the following order of precedence shall apply:,a),,Purchase order,b),,Printed wiring board drawings and drill and tr

18、im documentation,c),,This specification,d),,Documents referred to in this speciation.,,,Supplier shall use applicable fabrication panel coupon as defined in IPC-2221.Micro-sections coupon ,and solder samples shall be provided with each shipment for validation requirement.,,,,1.,,Maximum 3 repair ope

19、rations are allowed on each board and the number of repaired PCB’S cannot exceed the 10 percent of the entire lot population.,,2.,,Unless otherwise specified on the engineering drawing ,plated through via holes with a nominal size of 0.020inch or less may be partially or completely plugged with sold

20、er.,,3.,,As a preventive precaution .before the laying down of the solder ,the PCB’S will have to be washed to remove the residuals due to the production process, the clearing degree of the PCB’S before the coating has to be the following one MAX 1 ug /square cm..,,,,1.,,Solder mask (SMOBC)-Apply LP

21、I solder masks per IPC-SM-840 type B. class 3. color green and minimum solder masks thickness over the edges shall be 0.001”.LPI solder mask and solder shall meet the UL 94v-o requirements. There shall be no solder masks over the SMT pads ,there shall be no exposed traces on outside layers and solde

22、r mask opening should be 0.002”side larger than pad.,,2.,,PCB “Stack-Up” construction requirements are to be determined by the PCB vendor unless specified. Leitch will supply the overall nominal PCB thickness, and all other associated functional requirements. A Certificate of Compliance is required

23、 for all PCB’s, where Leitch has specified specific functional requirements. (e.g. Impedance specifications, etc..),,,,謝謝,,,,謝謝觀看,/,歡迎下載,BY FAITH I MEAN A VISION OF GOOD ONE CHERISHES AND THE ENTHUSIASM THAT PUSHES ONE TO SEEK ITS FULFILLMENT REGARDLESS OF OBSTACLES. BY FAITH I BY FAITH,內(nèi)容總結(jié),線路板專業(yè)名詞解釋。僅作為導(dǎo)通用（不作插件或焊接），如測試點(diǎn)和一般導(dǎo)通孔。一般是作為裝配零件的定位孔或工具孔。它是非焊接用的焊盤，通常為圓形或方形，有金屬窗和綠油窗。銅皮------命名為“銅皮”。此類Pad僅供裝配完后作為測試點(diǎn)，不裝配零件。印制板上無電氣性能，在制作過程中用于加工具孔、定位孔或Dummy等的部分。----特點(diǎn)：一般線寬/線間小于3mil/3mil?？v橫比（板厚孔徑比）---影響電鍍和噴錫。（鉛、鎘、六價(jià)鉻、水銀、PBB（多溴化聯(lián)苯）、PBDE（多溴聯(lián)苯醚）。其中PCB板主要檢測項(xiàng)目包括：PCB基材、阻焊、絲印、銅皮等。謝謝觀看/歡迎下載,